We separate, grind and polish different materials...
With the diamond-wire saws of Logomatic GmbH, our 100% daughter-company, we separate...
Ground silicon work-pieces will be wafered in this main process...
The grinding machines of G&N GmbH, our 100% daughter company, grind effortless...
With our infrared and lifetime measuring it is possible to check for SiC-nests (inclusions), cracks and other damages...
A homogeneous and efficiency rising surface structure will be produced at this process...
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We separate, grind and polish different materials...
With the diamond-wire saws of Logomatic GmbH, our 100% daughter-company, we separate...
Ground silicon work-pieces will be wafered in this main process...
The grinding machines of G&N GmbH, our 100% daughter company, grind effortless...
With our infrared and lifetime measuring it is possible to check for SiC-nests (inclusions), cracks and other damages...
A homogeneous and efficiency rising surface structure will be produced at this process...
