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The TWINevo precision grinding spindle with two grinding wheels enables roughing and finishing processes without re-clamping the workpiece. It is specially designed for machining high-precision workpieces. By using the TWINevo, we eliminate the use of a second spindle and save on the machine's installation space. We also reduce consumption costs such as electricity and water.


The spindle can be equipped with additional sensors, such as structure-borne noise sensors and pressure sensors, which actively support the grinding process. This spindle was manufactured specifically for the semiconductor market and is used by the grinding machine factory G&N Präzisionsmaschinenbau Nürnberg GmbH. Here SiC crystals are ground plane-parallel at the highest level.

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